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公开(公告)号:US11897689B2
公开(公告)日:2024-02-13
申请号:US17508774
申请日:2021-10-22
CPC分类号: B65D88/744 , B65D81/18 , B65D88/747 , F25B21/04 , F25B2321/023 , F25B2321/025 , F25B2321/0212 , F25D2700/123
摘要: The present application discloses temperature regulated apparatuses, methods, and computer program products for temperature regulated containers. An example temperature regulated apparatus includes a base container. The base container includes at least a base portion, one or more sidewall portions, and a lid portion. The example temperature regulated apparatus also includes one or more thermoelectric components, where (i) each of the one or more thermoelectric components are configured to be disposed within the interior of the base container, (ii) each thermoelectric component comprises an exterior surface, an interior surface, and a composite semiconductor layer disposed between the exterior surface and the interior surface, and (iii) each thermoelectric component is configured to, in an instance current flows through the thermoelectric component, transfer heat between the interior surface and exterior surface.