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公开(公告)号：US10355380B1
公开(公告)日：2019-07-16
申请号：US15938110
申请日：2018-03-28
Applicant: Intel Corporation
Inventor： Feroz Mohammad , Srinivasa Aravamudhan
CPC classification number: H01R12/52 , H01R12/716 , H01R12/722 , H05K7/2039
Abstract: An electronic device that includes a first electronic component with a pin element and a second electronic component with a solder element. A joint is formed that provides an electrical and mechanical connection between the first electronic component and second electronic component when the pin element is heated, inserted into the solder element, and cooled.
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公开(公告)号：US20190305451A1
公开(公告)日：2019-10-03
申请号：US15938110
申请日：2018-03-28
Applicant: Intel Corporation
Inventor： Feroz Mohammad , Srinivasa Aravamudhan
Abstract: An electronic device that includes a first electronic component with a pin element and a second electronic component with a solder element. A joint is formed that provides an electrical and mechanical connection between the first electronic component and second electronic component when the pin element is heated, inserted into the solder element, and cooled.
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公开(公告)号：US11569596B2
公开(公告)日：2023-01-31
申请号：US16833221
申请日：2020-03-27
Applicant: Intel Corporation
Inventor： Steven A. Klein , Kuang Liu , Srikant Nekkanty , Feroz Mohammad , Donald Tiendung Tran , Srinivasa Aravamudhan , Hemant Mahesh Shah , Alexander W. Huettis
Abstract: Systems, apparatus, and/or processes directed to applying pressure to a socket to alter a shape of the socket to improve a connection between the socket and a substrate, printed circuit board, or other component. The socket may receive one or more chips, may be an interconnect, or may be some other structure that is part of a package. The shape of the socket may be flattened so that a side of the socket may form a high-quality physical and electrical coupling with the substrate.
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