-
公开(公告)号：US20180006360A1
公开(公告)日：2018-01-04
申请号：US15198782
申请日：2016-06-30
Applicant: Intel Corporation
Inventor： Jose Rodrigo Camacho Perez , Seong-Youp J. Suh , Tae-Young Yang
CPC classification number: H01Q1/243 , H01Q1/2275 , H01Q1/48 , H01Q1/50 , H01Q5/40 , H01Q13/02 , H01Q21/28
Abstract: An antenna including a substrate; top and bottom grounded conductive layers formed on respective larger faces of the substrate; an antenna feed coupled to at least one of the top and bottom grounded conductive layers, and configured to feed radio signals to the antenna; and at least one conductive wall formed to the top and bottom grounded conductive layers, and configured to form a short-circuit between the top and bottom grounded conductive layers, wherein the substrate and the at least one conductive wall forms a plurality of antenna cavities configured to operate at specific, respective frequencies, and each of the plurality of antenna cavities comprises at least two sides not covered by a conductive layer.
-
公开(公告)号：US10511082B2
公开(公告)日：2019-12-17
申请号：US15198782
申请日：2016-06-30
Applicant: Intel Corporation
Inventor： Jose Rodrigo Camacho Perez , Seong-Youp J. Suh , Tae-Young Yang
Abstract: An antenna including a substrate; top and bottom grounded conductive layers formed on respective larger faces of the substrate; an antenna feed coupled to at least one of the top and bottom grounded conductive layers, and configured to feed radio signals to the antenna; and at least one conductive wall formed to the top and bottom grounded conductive layers, and configured to form a short-circuit between the top and bottom grounded conductive layers, wherein the substrate and the at least one conductive wall forms a plurality of antenna cavities configured to operate at specific, respective frequencies, and each of the plurality of antenna cavities comprises at least two sides not covered by a conductive layer.
-
Search Results
2
records
(took 0.036 seconds)
