公开(公告)号：US20180287305A1

公开(公告)日：2018-10-04

申请号：US15476582

申请日：2017-03-31

申请人： Intel Corporation

发明人： Youngseok Oh ,  Justin M. Huttula ,  Mohanraj Probhugoud ,  Ronald Kirby ,  Joe Walczyk ,  Erkan Acar

IPC分类号： H01R13/6594 ,  H01R13/11 ,  H01R13/6585 ,  H01R13/66 ,  H01R43/26

摘要： A shielded interconnect array and associated methods are described. Examples of the shielded interconnect array include socket connections that include conductive members with flexible bends. In examples shown, corresponding grounded conductive members with flexible bends are located adjacent to other conductive members with flexible bends to provide shielding.