公开(公告)号：US20030001604A1

公开(公告)日：2003-01-02

申请号：US09897252

申请日：2001-07-02

Applicant: Intel Corporation

Inventor： David H. Pullen ,  Richard Kacprowicz

IPC: G01R031/02

CPC classification number: G01R31/287 ,  G01R31/2642 ,  G01R31/2849

Abstract: Improved methods for performing burn-in of electronic components, such as integrated circuits (ICs) with on-board thermal sense circuits, are used to obtain a higher bin split. According to one embodiment, a thermal set-point is loaded into each IC. While the ICs are maintained at a constant elevated temperature, the burn-in system checks each IC to determine whether the set-point has been exceeded. If so, it characterizes the IC by that set-point; if not, it decrements the set-point and checks again. The method continues until all ICs have been characterized to a specific set-point. As a result of the method, a junction temperature is obtained for each IC. In addition, a real-time estimate of the burn-in time for each IC is obtained, so that burn-in time can be adjusted to maximize burn-in throughput. Apparatus for implementing improved IC burn-in is also described.

Abstract translation: 使用改进的用于执行电子部件老化的方法，例如具有板上热感测电路的集成电路（IC），以获得更高的分支。 根据一个实施例，热设定点被加载到每个IC中。 当IC保持恒定的高温时，老化系统会检查每个IC以确定是否已经超过了设定点。 如果是这样，它将通过该设定点来表征IC; 如果不是，它会减少设定点并重新检查。 该方法继续，直到所有的IC被表征到特定的设定点。 作为该方法的结果，获得每个IC的结温。 此外，获得每个IC的老化时间的实时估计，从而可以调整老化时间以最大化老化吞吐量。 还描述了用于实现改进的IC老化的装置。

公开(公告)号：US20020151110A1

公开(公告)日：2002-10-17

申请号：US10163823

申请日：2002-06-04

Applicant: Intel Corporation

Inventor： Terrance J. Dishongh ,  Paul W. Churilla ,  David H. Pullen

IPC: H01L021/44 ,  H01L021/48 ,  H01L023/10 ,  H01L023/34

CPC classification number: H01L23/3736 ,  H01L21/50 ,  H01L23/433 ,  H01L2224/16 ,  H01L2924/15311 ,  H01L2924/16152

Abstract: According to one aspect of the invention a method of constructing an electronic assembly is provided. The electronic assembly is constructed from a semiconductor package including a package substrate and a semiconductor chip mounted to the package substrate, a thermally conductive member, and a substance including indium. The method comprises securing the thermally conductive member and the semiconductor package in a selected orientation relative to one another with the thermally conductive member on a side of the semiconductor chip opposing the package substrate and with the substance located between the semiconductor chip and at least a portion of the thermally conductive member. The substance is thermally coupled to the semiconductor chip on one side and thermally coupled to the portion of the thermally conductive member on an opposing side.

Abstract translation: 根据本发明的一个方面，提供一种构建电子组件的方法。 电子组件由包括封装衬底和安装在封装衬底上的半导体芯片，导热构件和包括铟的物质的半导体封装构成。 该方法包括使导热构件和半导体封装相对于彼此以选定的取向固定，其中导热构件在半导体芯片的与封装衬底相对的一侧上，并且物质位于半导体芯片与至少一部分之间 的导热构件。 物质在一侧热耦合到半导体芯片，并且在相对侧热耦合到导热部件的部分。