公开(公告)号：US20210285980A1

公开(公告)日：2021-09-16

申请号：US17196101

申请日：2021-03-09

Applicant: Infineon Technologies AG

Inventor： Gernot BINDER ,  Ferdinand GASTINGER ,  Stephanie JANKOWSKI ,  Thomas LASSLEBEN

IPC: G01P3/487 ,  G01R33/00 ,  G01D11/24 ,  G01D5/14

Abstract: A sensor device includes a magnetic field sensor component, including a chip carrier having a connection conductor and a magnetic field sensor chip arranged on the chip carrier, and a magnet, wherein the magnetic field sensor component is arranged on a mounting surface of the magnet, wherein the mounting surface has an elevation and the connection conductor is bent around the elevation.