公开(公告)号：US20250054842A1

公开(公告)日：2025-02-13

申请号：US18792118

申请日：2024-08-01

Applicant: Infineon Technologies AG

Inventor： Rowel TABAJONDA ,  Michael STADLER ,  Aira Lourdes Baring VILLAMOR ,  Mei Yih GOH ,  Juliane JUNESCH ,  Chee Voon TAN ,  Mei Qi TAY

IPC: H01L23/495 ,  H01L23/00

Abstract: A package including a component for a package is disclosed. In one example, wherein the component comprises a functional body, and a wettability layer arranged on a main surface of the functional body and configured for promoting wetting of a connection medium to be applied on the wettability layer for connecting the component with a further component of the package. The wettability layer has a lateral circumference at least part of which having a concave edge.