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公开(公告)号：US20240118111A1
公开(公告)日：2024-04-11
申请号：US17938873
申请日：2022-10-07
Applicant: Infineon Technologies AG
Inventor： Simon HAINZ , Matthias POHL
CPC classification number: G01D5/16 , G01R33/098
Abstract: A sensor module may include a back-bias magnet with a magnetization in a first direction. The sensor module may include a sensor chip including a first set of tunnel magnetoresistive (TMR) sensing elements. The sensor chip may be configured to determine a characteristic of a first magnetic field component using the first set of TMR sensing elements, and to generate a sensor signal based at least in part on the characteristic of the first magnetic field component. A value of the sensor signal may correspond to a linear position of a ferromagnetic object.
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