公开(公告)号：US20240145408A1

公开(公告)日：2024-05-02

申请号：US18378858

申请日：2023-10-11

申请人： Infineon Technologies AG

发明人： Maria HEIDENBLUT ,  Michael GOROLL ,  Stefan KAISER ,  Sergey ANANIEV ,  Sabine BOGUTH ,  Gunther MACKH ,  Andreas BAUER ,  Georg Michael REUTHER

IPC分类号： H01L23/00 ,  H01L21/78 ,  H01L23/31 ,  H01L23/58

CPC分类号： H01L23/562 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/585

摘要： An electronic chip is disclosed. In one example, the electronic chip comprises a substrate comprising a central portion and an edge portion around at least part of the central portion. An active region is arranged in the central portion. A crack guiding structure combined with a crack stop structure is provided, both being arranged in the edge portion.