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公开(公告)号:US20230082571A1
公开(公告)日:2023-03-16
申请号:US17945494
申请日:2022-09-15
发明人: Jochen HILSENBECK , Thomas SOELLRADL , Roman ROTH , Annette SAENGER , Ulrike FASTNER , Johanna SCHLAMINGER , Joachim HIRSCHLER , Andreas BEHRENDT
摘要: A power semiconductor device includes a semiconductor body and a first terminal at the semiconductor body. The first terminal has a first side for adjoining an encapsulation and a second side for adjoining the semiconductor body. The first terminal includes, at the first side, a top layer; and, at the second side, a base layer coupled with the top layer, wherein a sidewall of the top layer and/or a sidewall of the base layer is arranged in an angle smaller than 85° with respect to a plane.