公开(公告)号：US09130080B2

公开(公告)日：2015-09-08

申请号：US13943810

申请日：2013-07-17

Applicant: Industrial Technology Research Institute

Inventor： Zhi-Cheng Hsiao ,  Ming-Ji Dai ,  Cheng-Ta Ko

IPC: H01L31/024 ,  H01L27/146

CPC classification number: H01L31/024 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/1469

Abstract: An encapsulation of backside illumination photosensitive device including a circuit sub-mount, a backside illumination photosensitive device, a plurality of conductive terminals, and a heat dissipation structure is provided. The backside illumination photosensitive device includes an interconnection layer and a photosensitive device array, wherein the interconnection layer is located on the circuit sub-mount, and between the photosensitive device array and the circuit sub-mount. The conductive terminals are located between the interconnection layer and the circuit sub-mount to electrically connect the interconnection layer and the circuit sub-mount. The heat dissipation structure is located under the interconnection layer, and the heat dissipation structure and the photosensitive device array are respectively located at two opposite sides of the interconnection layer.

Abstract translation: 提供了包括电路子安装座，背面照明光敏装置，多个导电端子和散热结构的背面照明光敏装置的封装。 背面照明光敏装置包括互连层和感光器件阵列，其中互连层位于电路子座上，并且位于感光器件阵列和电路子座之间。 导电端子位于互连层和电路子座之间，以电连接互连层和电路子座。 散热结构位于互连层下方，散热结构和感光器件阵列分别位于互连层的两个相对侧。

公开(公告)号：US20160043239A1

公开(公告)日：2016-02-11

申请号：US14919744

申请日：2015-10-22

Applicant: Industrial Technology Research Institute

Inventor： Hsiang-Hung Chang ,  Wen-Chih Chen ,  Chia-Wei Jui ,  Zhi-Cheng Hsiao ,  Cheng-Ta Ko ,  Rong-Shen Lee ,  Sheng-Shu Yang

IPC: H01L31/02 ,  H01L31/0203

CPC classification number: H01L31/02002 ,  H01L23/481 ,  H01L24/09 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/1469 ,  H01L31/0203 ,  H01L2224/05009

Abstract: Conductive plug structures suitable for stacked semiconductor device package is provided, wherein large contact region between the conductive plug structures and the corresponding pads of devices can be achieved, to reduce electrical impedance. Therefore, package structures such as photosensitive device packages using the conductive plug structures have superior electrical performance and reliability.

Abstract translation: 提供适用于层叠半导体器件封装的导电插塞结构，其中可以实现导电插塞结构和相应的器件焊盘之间的大的接触区域，以减少电阻抗。 因此，使用导电插塞结构的诸如光敏器件封装的封装结构具有优异的电性能和可靠性。

公开(公告)号：US20140291790A1

公开(公告)日：2014-10-02

申请号：US13943810

申请日：2013-07-17

Applicant: Industrial Technology Research Institute

Inventor： Zhi-Cheng Hsiao ,  Ming-Ji Dai ,  Cheng-Ta Ko

IPC: H01L31/024 ,  H01L27/146

CPC classification number: H01L31/024 ,  H01L27/14621 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/1469

Abstract: An encapsulation of backside illumination photosensitive device including a circuit sub-mount, a backside illumination photosensitive device, a plurality of conductive terminals, and a heat dissipation structure is provided. The backside illumination photosensitive device includes an interconnection layer and a photosensitive device array, wherein the interconnection layer is located on the circuit sub-mount, and between the photosensitive device array and the circuit sub-mount. The conductive terminals are located between the interconnection layer and the circuit sub-mount to electrically connect the interconnection layer and the circuit sub-mount. The heat dissipation structure is located under the interconnection layer, and the heat dissipation structure and the photosensitive device array are respectively located at two opposite sides of the interconnection layer.

Abstract translation: 提供了包括电路子安装座，背面照明光敏装置，多个导电端子和散热结构的背面照明光敏装置的封装。 背面照明光敏装置包括互连层和感光器件阵列，其中互连层位于电路子座上，并且位于感光器件阵列和电路子座之间。 导电端子位于互连层和电路子座之间，以电连接互连层和电路子座。 散热结构位于互连层下方，散热结构和感光器件阵列分别位于互连层的两个相对侧。