公开(公告)号：US11244937B2

公开(公告)日：2022-02-08

申请号：US16706799

申请日：2019-12-08

Applicant: Industrial Technology Research Institute

Inventor： Wei-Sheng Su ,  Chia-Hsin Chao ,  Mao-Chi Lin ,  Yen-Hsiang Fang ,  Li-Chun Huang ,  Ming-Hsien Wu

IPC: G09G3/32 ,  G02B5/08 ,  H01L25/16 ,  H01L23/498 ,  H01L23/544

Abstract: A spliced display including a transparent substrate, a plurality of light emitting diode modules, at least one control element and a signal transmission structure is provided. The transparent substrate has a display surface and a back surface opposite to each other. The light emitting diode modules are disposed on the back surface of the transparent substrate to be spliced with each other. Each of the light emitting diode modules includes a driving backplane and a plurality of micro light emitting diodes, and the micro LEDs are disposed in an array between the driving backplane and the transparent substrate. The control element is disposed on the transparent substrate. The control element is connected to the light emitting diode modules via the signal transmission structure, and the light emitting diode modules are connected to each other via the signal transmission structure.

公开(公告)号：US20220384396A1

公开(公告)日：2022-12-01

申请号：US17561991

申请日：2021-12-26

Applicant: Industrial Technology Research Institute

Inventor： Wei-Sheng Su ,  Chia-Hsin Chao

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/64

Abstract: Provided is a display apparatus including a transparent substrate, display modules on the transparent substrate, an interconnect, a cover layer and a control device. The display module includes a first circuit board, LED devices and a molding layer. The first circuit board has first and second surfaces opposite to each other, and is disposed on the transparent substrate with the first surface facing the transparent substrate. The LED devices are disposed on the first surface and electrically connected to the first circuit board. The molding layer is disposed on the first surface to cover the LED devices. The interconnect is disposed in the first circuit board and on the second surface to electrically connect the display modules to each other. The cover layer covers the display modules and the interconnect. The control device is electrically connected to a portion of the interconnect adjacent to the edge of the transparent substrate.