公开(公告)号：US20210202333A1

公开(公告)日：2021-07-01

申请号：US15931525

申请日：2020-05-13

申请人： Industrial Technology Research Institute

发明人： Hong-Ming DAI ,  Jane-Hway LIAO ,  Yen-Ching KUO ,  Shu-Tang YEH ,  Wei-Lung TSAI ,  Hung-Yi CHEN ,  Chien-Chang HUNG

IPC分类号： H01L23/29 ,  H01L23/31

摘要： An encapsulation structure may include a flexible substrate, a plurality of electronic elements, a first partition wall, a second partition wall, and a gas barrier layer. The flexible substrate has a device region and a non-device region. The electronic elements are disposed in the device region of the flexible substrate. The first partition wall surrounds one or more of the electronic elements. The second partition wall surrounds the first partition wall. There is at least one trench between the first partition wall and the second partition wall. The gas barrier layer covers one or more of the electronic elements and the surface of the first partition wall. The surface of the first partition wall has a higher surface energy than the surface of the second partition wall.