ADDITION SYSTEM AND METHOD OF REDUCING AGENT IN SEMICONDUCTOR MANUFACTURING PROCESS

    公开(公告)号:US20240153788A1

    公开(公告)日:2024-05-09

    申请号:US18360771

    申请日:2023-07-27

    CPC classification number: H01L21/67017 H01L21/67253

    Abstract: An addition system of a reducing agent in a semiconductor manufacturing process includes pre-treatment and post-treatment gas concentration detection devices, a process exhaust gas treatment device, a reducing agent supply device, and an addition system control device. The process exhaust gas treatment device purifies exhaust gas of a semiconductor manufacturing process and emits a post-treatment gas. The reducing agent supply device supplies a reducing agent gas into the process exhaust gas treatment device. The post-treatment gas concentration detection device detects a residual concentration of the reducing agent gas in the post-treatment gas. The addition system control device calculates destruction and removal efficiency (DRE) for process gases according to pre-treatment and post-treatment gas concentrations, and, according to the DRE and the residual concentration, sends a signal to the reducing agent supply device to control the amount of the reducing agent gas added.

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