公开(公告)号：US20200156211A1

公开(公告)日：2020-05-21

申请号：US16233859

申请日：2018-12-27

Applicant: Industrial Technology Research Institute

Inventor： Cheng-Peng Kuan ,  Chih-Hsuan Shih ,  Kuo-Feng Hung ,  Yen-Chung Chang ,  Hung-Hsiu Yu

IPC: B24B51/00 ,  B25J11/00 ,  B24B21/16 ,  B24B49/00

Abstract: A method for controlling polishing and grinding is provided, including: generating an initial polishing and grinding trajectory for robot movements based on a three-dimensional contour of a work piece; adjusting the initial polishing and grinding trajectory based on a first optimized adjustment value and generating an optimized polishing and grinding trajectory; and evaluating the polishing and grinding quality of the work piece and using the polishing and grinding quality to generate a second optimized adjustment value.