公开(公告)号：US20220375815A1

公开(公告)日：2022-11-24

申请号：US17259938

申请日：2020-12-28

Applicant: Innoscience (Suzhou) Technology Co., Ltd.

Inventor： Jingyu SHEN ,  Qiyue ZHAO ,  Chunhua ZHOU ,  Chao YANG ,  Weigang YAO ,  Baoli WEI

IPC: H01L23/367 ,  H01L21/56 ,  H01L23/31 ,  H01L23/498

Abstract: A flip-chip semiconductor package with improved heat dissipation capability and low package profile is provided. The package comprises a heat sink having a plurality of heat dissipation fins and a plurality of heat dissipation leads. The heat dissipation leads are connected to a plurality of thermally conductive vias of a substrate so as to provide thermal conductivity path from the heatsink to the substrate as well as support the heatsink to relieve compressive stress applied to a semiconductor die by the heatsink. The package further comprises an encapsulation layer configured to cover the heat dissipation leads of the heat sink and expose the heat dissipation fins of the heat sink.

公开(公告)号：US20230354525A1

公开(公告)日：2023-11-02

申请号：US17624355

申请日：2021-05-06

Applicant: INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.

Inventor： Weigang YAO ,  Chunhua ZHOU

IPC: H05K1/18 ,  H01L23/498 ,  H01L23/31 ,  H01L23/367 ,  H05K1/02 ,  H05K1/11 ,  H05K3/32 ,  H01L21/48

CPC classification number: H05K1/183 ,  H01L21/4853 ,  H01L23/3107 ,  H01L23/3672 ,  H01L23/49811 ,  H01L23/49844 ,  H05K1/021 ,  H05K1/111 ,  H05K1/184 ,  H05K3/325 ,  H05K2201/1059 ,  H05K2201/10621

Abstract: The present disclosure provides a semiconductor module comprising a semiconductor device removably pressed-fit in a cavity formed in a printed circuit board and methods for manufacturing the same. The semiconductor device and the cavity of the printed circuit board can cooperate with each other and act as an electrical plug and an electrical socket respectively. Soldering the semiconductor device on the printed circuit board can be avoided. Therefore, the packaging process can be more flexible and reliability issues with solder joints can be eliminated. Moreover, heatsink can be mounted on top and/or bottom of the semiconductor device after being received in the cavity of the printed circuit board. Thermal dissipation efficiency can be greatly enhanced.

公开(公告)号：US20220376101A1

公开(公告)日：2022-11-24

申请号：US17427923

申请日：2021-02-25

Applicant: INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.

Inventor： Hao LI ,  King Yuen WONG ,  Weigang YAO

IPC: H01L29/778 ,  H01L29/20 ,  H01L29/417 ,  H01L29/423

Abstract: A semiconductor device includes a drain electrode, a first source electrode, a second source electrode, a first gate electrode, and a second gate electrode. The first gate electrode is arranged between the first source electrode and the drain electrode. The first gate electrode extends along a first direction. The second gate electrode is arranged between the second source electrode and the drain electrode. The second gate electrode extends along the first direction. The first gate electrode is arranged above a first imaginary line substantially perpendicular to the first direction in a top view of the semiconductor device and the second gate electrode is arranged below a second imaginary line substantially perpendicular to the first direction in the top view of the semiconductor device.

公开(公告)号：US20220359454A1

公开(公告)日：2022-11-10

申请号：US17567845

申请日：2022-01-03

Applicant: INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.

Inventor： Weigang YAO ,  Chunhua ZHOU

IPC: H01L23/00 ,  H01L23/367 ,  H01L23/13 ,  H01L23/498 ,  H01L21/48

Abstract: The present disclosure provides a semiconductor module comprising a semiconductor device removably pressed-fit in a cavity formed in a printed circuit board and methods for manufacturing the same. The semiconductor device and the cavity of the printed circuit board can cooperate with each other and act as an electrical plug and an electrical socket respectively. Soldering the semiconductor device on the printed circuit board can be avoided. Therefore, the packaging process can be more flexible and reliability issues with solder joints can be eliminated. Moreover, heatsink can be mounted on top and/or bottom of the semiconductor device after being received in the cavity of the printed circuit board. Thermal dissipation efficiency can be greatly enhanced.