专利检索 ap:("INDUSTRY FOUNDATION OF CHONNAM NATIONAL UNIVERSITY") AND inv:"Hyeonseok Yoon" 第 1 页

1.

发明授权
Integrated conductive polymer binder composition, method for preparing the binder composition, and applications comprising the binder composition 有权

公开(公告)号：US11257606B2

公开(公告)日：2022-02-22

申请号：US15021564

申请日：2014-09-16

申请人： INDUSTRY FOUNDATION OF CHONNAM NATIONAL UNIVERSITY

发明人： Hyeonseok Yoon , Minjeong Kang

IPC分类号： C09D165/00 , H01B1/12 , C09D5/08 , C09D179/02 , C09D179/04 , H01G11/48 , H01G11/86 , H01G11/38 , C08G73/02 , C08L79/02 , C08J3/09 , C08J3/11 , C09D7/40 , C08K5/053 , C09D5/24 , C08G61/12

摘要： The present invention relates to a polymer binder composition, and more specifically, to an integrated conductive polymer binder composition simultaneously having adhesion and conductivity, a method for preparing the binder composition, an energy storage device comprising the binder composition, a sensor comprising a sensing portion formed from the binder composition, and an anticorrosive coating composition comprising the binder composition as an active component.