公开(公告)号：US20230071114A1

公开(公告)日：2023-03-09

申请号：US17985715

申请日：2022-11-11

申请人： Hutchinson Technology Incorporated

发明人： John L. Schumann ,  Nole D. German ,  Trent A. Johnson ,  Duane M. Jelkin ,  Matthew S. Lang ,  Ryan N. Ruzicka ,  Forrest A. Cravens ,  Todd A. Peter ,  Zachary A. Pokornowski

IPC分类号： H01F27/28 ,  C25D7/00 ,  C25D3/38 ,  H05K1/18 ,  H05K1/11 ,  G06K19/07 ,  G11B5/48 ,  H01F41/04

摘要： Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.

公开(公告)号：US11521785B2

公开(公告)日：2022-12-06

申请号：US16693125

申请日：2019-11-22

申请人： Hutchinson Technology Incorporated

发明人： John L. Schumann ,  Nole D. German ,  Trent A. Johnson ,  Duane M. Jelkin ,  Matthew S. Lang ,  Ryan N. Ruzicka ,  Forrest A. Cravens ,  Todd A. Peter ,  Zachary A. Pokornowski

IPC分类号： B32B3/00 ,  H01F27/28 ,  C25D7/00 ,  C25D3/38 ,  H05K1/18 ,  H05K1/11 ,  G06K19/07 ,  G11B5/48 ,  H01F41/04

摘要： Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.

公开(公告)号：US20200090854A1

公开(公告)日：2020-03-19

申请号：US16693125

申请日：2019-11-22

申请人： Hutchinson Technology Incorporated

发明人： John L. Schumann ,  Nole D. German ,  Trent A. Johnson ,  Duane M. Jelkin ,  Matthew S. Lang ,  Ryan N. Ruzicka ,  Forrest A. Cravens ,  Todd A. Peter ,  Zachary A. Pokomowski

IPC分类号： H01F27/28 ,  C25D7/00 ,  C25D3/38 ,  H05K1/18 ,  H05K1/11 ,  H01F41/04 ,  G06K19/07 ,  G11B5/48

摘要： Devices including a substrate and a plurality of coil portions disposed on the substrate. The plurality of coil portions electrically coupled to form a coil structure.