公开(公告)号：US20130322661A1

公开(公告)日：2013-12-05

申请号：US13482350

申请日：2012-05-29

申请人： Hung-Jen CHEN ,  Kuan-Hsun Chiu ,  Chun-Chieh Wang ,  Min-Li Hsu

发明人： Hung-Jen CHEN ,  Kuan-Hsun Chiu ,  Chun-Chieh Wang ,  Min-Li Hsu

IPC分类号： H04R19/04

CPC分类号： H04R19/04 ,  H04R19/005 ,  H04R31/00

摘要： A MEMS microphone chip with an expanded back chamber includes a first chip unit and a second chip unit. The first chip unit has a first substrate, a vibration membrane layer is formed. above an end of the first substrate, and a space is formed below the vibration membrane layer of the first substrate, so that the vibration membrane layer is suspended above the first substrate to vibrate. The second chip unit has a second substrate to couple with another end of the first substrate, and a groove is formed in the second substrate with. a width larger than that of the space; when the first substrate and the second substrate are coupled together, the groove and the space are connected together to act as the back chamber of the vibration membrane layer.

摘要翻译： 具有扩展后室的MEMS麦克风芯片包括第一芯片单元和第二芯片单元。 第一芯片单元具有第一基板，形成振动膜层。 在第一基板的端部之上，并且在第一基板的振动膜层的下方形成空间，使得振动膜层悬挂在第一基板上方振动。 第二芯片单元具有与第一基板的另一端连接的第二基板，并且在第二基板中形成有凹槽。 宽度大于空间的宽度; 当第一基板和第二基板联接在一起时，槽和空间连接在一起以用作振动膜层的后室。