公开(公告)号：US12041710B2

公开(公告)日：2024-07-16

申请号：US17451995

申请日：2021-10-22

Applicant: Huawei Technologies Co., Ltd.

Inventor： Zhen Sun ,  Zhen Lu ,  Yuping Hong

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0203 ,  H05K7/20336

Abstract: A heat dissipation apparatus is provided. The heat dissipation apparatus includes a thermally conductive housing. The heat dissipation apparatus is connectable to a chip so that the chip is arrangeable on a chip placement region of the thermally conductive housing. A capillary structure is disposed on the thermally conductive housing and a working medium is placed in the capillary structure. The capillary structure includes a first capillary structure and a second capillary structure that are connected, and a maximum thickness of the first capillary structure is less than a minimum thickness of the second capillary structure.