Thermally Conductive Structure and Manufacturing Method Thereof, Heat Sink, and Electronic Device Including Heat Sink

    公开(公告)号:US20240318922A1

    公开(公告)日:2024-09-26

    申请号:US18737095

    申请日:2024-06-07

    CPC classification number: F28D15/046 F28D2021/0029

    Abstract: A thermally conductive structure is provided. The thermally conductive structure includes a thermally conductive plate and a first capillary structure formed by using an electrochemical deposition process. The first capillary structure is disposed on a side that is of the thermally conductive plate and that is opposite to a heat source. The first capillary structure has a plurality of media pores with different pore sizes, the plurality of media pores all extend along a thickness direction of the first capillary structure, and the plurality of media pores all run through the first capillary structure. The thermally conductive structure in this application can prevent untimely liquid flowback and resolve a problem of an excessively high temperature difference at a high heat flux density, thereby improving applicability and heat dissipation effect of the thermally conductive structure.

    Die casting aluminum alloy and production method thereof, and communications product

    公开(公告)号:US10337085B2

    公开(公告)日:2019-07-02

    申请号:US14731208

    申请日:2015-06-04

    Abstract: Embodiments of the present invention provide a die casting aluminum alloy, including the following components in percentage by mass: 11.0% to 14.0% of silicon; 0.1% to 0.9% of manganese; 0.1% to 1.0% of magnesium; 0.3% to 1.4% of iron; less than or equal to 0.2% of copper; and aluminum and inevitable impurities. The die casting aluminum alloy has good formability, heat conductivity, and corrosion resistance, and certain mechanical properties, which can avoid problems of a low yield of die-casting fittings, burn-in caused by severe heat emission of a product, corrosion in a coastal environment, assembly difficulties caused by insufficient mechanical properties, severe deformation in a wind load condition, and the like, so as to satisfy requirements of global delivery of complex communications products.

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