公开(公告)号：US12212943B2

公开(公告)日：2025-01-28

申请号：US17638361

申请日：2020-07-16

Applicant: Huawei Technologies Co., Ltd.

Inventor： Fang-Ching Lee ,  Shijia Pi ,  Lin Lu ,  Guofei Diao ,  Zhonghua Wang

IPC: H04R1/10 ,  H04R5/033

Abstract: This application provides a wireless headset, and relates to the field of TWS wireless headsets. The wireless headset includes a headset housing and a headset assembly accommodated in the headset housing. The headset assembly includes a microphone. The headset housing includes a bottom housing, the bottom housing includes a first bottom housing part and a second bottom housing part that are separated by using an insulating material, the first bottom housing part is a positive charging electrode, and the second bottom housing part is a negative charging electrode. A plurality of sound inlet holes are disposed on the bottom housing, and form microphone sound inlet channels communicating with each other. In the foregoing technical solutions, wind noise can be reduced, and call experience can be improved.