公开(公告)号：US20230207235A1

公开(公告)日：2023-06-29

申请号：US18171472

申请日：2023-02-20

Applicant: Huawei Technologies Co., Ltd.

Inventor： Fumio TAMURA ,  Yake ZOU ,  Ryo OTSUKA

IPC: H01H13/705 ,  H01H13/14 ,  H01H13/20

CPC classification number: H01H13/705 ,  H01H13/14 ,  H01H13/20

Abstract: Provided herein is a keyboard assembly that includes a keyboard substrate, a plurality of keycaps, and a plurality of lifting supports. Each keycap is connected to the keyboard substrate by using a lifting support. The keyboard substrate is connected to a bottom plate and a top plate, with the bottom plate including a key accommodation groove that further includes a concave slope. The lifting support is located in the key accommodation groove, with one end abutting against the concave slope and being capable of sliding on the concave slope. In a process in which the top plate rotates to a first specified location, the keyboard substrate is driven to move, the lifting support descends, and the keycap descends. In a process in which the top plate rotates to a second specified location, the keyboard substrate is driven to move.