公开(公告)号：US08152372B1

公开(公告)日：2012-04-10

申请号：US12121581

申请日：2008-05-15

Applicant: Hsui-Peng Peng ,  Jae-Hong Lee

Inventor： Hsui-Peng Peng ,  Jae-Hong Lee

IPC: G01K7/00 ,  G01K3/00

CPC classification number: G01K15/00 ,  G01R31/2894

Abstract: Described herein are methods and apparatuses for testing an integrated circuit chip including a thermal diode. According to various embodiments, a method for testing an integrated circuit chip including a thermal diode may comprise performing a test operation on the integrated circuit chip, and during the test operation, detecting a signal representative of a temperature sensed by a thermal diode embedded in the integrated circuit chip. Other embodiments may be described and claimed.

Abstract translation: 这里描述了用于测试包括热二极管的集成电路芯片的方法和装置。 根据各种实施例，用于测试包括热二极管的集成电路芯片的方法可以包括对集成电路芯片执行测试操作，并且在测试操作期间，检测表示由嵌入在所述热二极管中的热二极管感测的温度的信号 集成电路芯片。 可以描述和要求保护其他实施例。