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    Apparatus for evaluating semiconductor substrate
    1.
    外观设计
    Apparatus for evaluating semiconductor substrate 有权

    公开(公告)号：USD989144S1

    公开(公告)日：2023-06-13

    申请号：US29789674

    申请日：2021-10-13

    Applicant: Hitachi High-Tech Corporation

    Designer： Masayuki Arakawa ,  Junpei Hokari ,  Akira Kojima ,  Masaki Mizuochi ,  Tomokazu Kobayashi ,  Takaaki Kikuchi

    Abstract: FIG. 1 is a front, top, and right side perspective view of an apparatus for evaluating semiconductor substrate according to the design;
    FIG. 2 is a front elevational view thereof;
    FIG. 3 is a rear elevational view thereof;
    FIG. 4 is a left side elevational view thereof;
    FIG. 5 is a right side elevational view thereof;
    FIG. 6 is a top plan view thereof;
    FIG. 7 is a bottom plan view thereof;
    FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 2; and,
    FIG. 9 is a cross-sectional view taken along line 9-9 of FIG. 2.
    The broken lines illustrate portions of the apparatus for evaluating semiconductor substrate that form no part of the claimed design. The hatching shown in FIG. 8 and FIG. 9 represents unclaimed subject matter and forms no part of the claimed design.

    Apparatus for evaluating semiconductor substrate
    2.
    外观设计
    Apparatus for evaluating semiconductor substrate 有权

    公开(公告)号：USD989831S1

    公开(公告)日：2023-06-20

    申请号：US29789677

    申请日：2021-10-13

    Applicant: Hitachi High-Tech Corporation

    Designer： Masayuki Arakawa ,  Junpei Hokari ,  Akira Kojima ,  Masaki Mizuochi ,  Tomokazu Kobayashi ,  Takaaki Kikuchi

    Abstract: FIG. 1 is a front, top, and right side perspective view of an apparatus for evaluating semiconductor substrate according to the design;
    FIG. 2 is a front elevational view thereof;
    FIG. 3 is a rear elevational view thereof;
    FIG. 4 is a left side elevational view thereof;
    FIG. 5 is a right side elevational view thereof;
    FIG. 6 is a top plan view thereof;
    FIG. 7 is a bottom plan view thereof;
    FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 2; and,
    FIG. 9 is a cross-sectional view taken along line 9-9 of FIG. 2.
    The broken lines illustrate portions of the apparatus for evaluating semiconductor substrate that form no part of the claimed design. The hatching shown in FIG. 8 and FIG. 9 represents unclaimed subject matter and forms no part of the claimed design.

    Reagent transportation robot
    3.
    外观设计
    Reagent transportation robot 有权

    公开(公告)号：USD1028792S1

    公开(公告)日：2024-05-28

    申请号：US29860870

    申请日：2022-11-23

    Applicant: Hitachi High-Tech Corporation

    Designer： Akira Kojima ,  Hiroki Takahashi ,  Tomohiro Inoue ,  Tomoko Tomiyama

    Abstract: FIG. 1 is a front, top and right side perspective view of a reagent transportation robot according to the design;
    FIG. 2 is a rear, top and left side perspective view thereof;
    FIG. 3 is a front view thereof;
    FIG. 4 is a right side view thereof;
    FIG. 5 is a left side view thereof;
    FIG. 6 is a rear view thereof;
    FIG. 7 is a top plan view thereof;
    FIG. 8 is a bottom plan view thereof;
    FIG. 9 is a cross-sectional view taken along line 9-9 of FIG. 3;
    FIG. 10 is a cross-sectional view taken along line 10-10 of FIG. 3;
    FIG. 11 is a cross-sectional view taken along line 11-11 of FIG. 3;
    FIG. 12 is an enlarged view of the portion shown in the dot-dash line box labeled FIG. 12 in FIG. 1; and,
    FIG. 13 is an enlarged view of the portion shown in the dot-dash line box labeled FIG. 13 in FIG. 2.
    The broken lines illustrate portions of the reagent transportation robot that form no part of the claimed design. The dot-dash line boxes shown in FIGS. 1-2 define the enlarged portions shown in FIGS. 12-13, and form no part of the claimed design.

    Semiconductor substrate transfer apparatus
    5.
    外观设计
    Semiconductor substrate transfer apparatus 有权

    公开(公告)号：USD989830S1

    公开(公告)日：2023-06-20

    申请号：US29789675

    申请日：2021-10-13

    Applicant: Hitachi High-Tech Corporation

    Designer： Masayuki Arakawa ,  Junpei Hokari ,  Akira Kojima ,  Masaki Mizuochi ,  Tomokazu Kobayashi ,  Takaaki Kikuchi

    Abstract: FIG. 1 is a front, top, and right side perspective view of a semiconductor substrate transfer apparatus according to the design;
    FIG. 2 is a front elevational view thereof;
    FIG. 3 is a rear elevational view thereof;
    FIG. 4 is a left side elevational view thereof;
    FIG. 5 is a right side elevational view thereof;
    FIG. 6 is a top plan view thereof;
    FIG. 7 is a bottom plan view thereof; and,
    FIG. 8 is a cross-sectional view taken along line 8-8 of FIG. 2.
    The broken lines illustrate portions of the semiconductor substrate transfer apparatus that form no part of the claimed design. The hatching shown in FIG. 8 represents unclaimed subject matter and forms no part of the claimed design.

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