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    Optical module
    2.
    发明授权
    Optical module 有权

    公开(公告)号：US10575382B2

    公开(公告)日：2020-02-25

    申请号：US16297853

    申请日：2019-03-11

    申请人： Hisense Broadband Multimedia Technologies Co., Ltd. ,  Hisense Broadband Multimedia Technologies, Ltd.

    发明人： Long Zheng

    IPC分类号： H04K3/00 ,  H05B37/02 ,  H05K1/00 ,  F21V29/504 ,  F21V29/508 ,  F21V29/83 ,  F21V5/04 ,  F21V23/00 ,  G02B6/42 ,  H05K9/00 ,  H04B10/40 ,  H04B10/50 ,  H04B10/85 ,  H04B15/02

    摘要： The present disclosure generally relates to optical modules, and in particular, to an optical module comprising a printed circuit board for reducing crosstalk between differential signal lines. In one implementation, the printed circuit board comprises a top layer, a first intermediate signal transmission layer, a second intermediate signal transmission layer, a bottom layer and multiple ground layers between signal transmission layers. Each signal transmission layer comprises one or more differential signal line pairs. The top layer and the bottom layer each comprises an edge connector, and the top layer further comprises a laser driver chip. The signal transmission layers are connected to the edge connectors and laser driver chips via a combination of blind and through connection holes such that the interference between the differential signal line pairs of various signal transmission layers are reduced.

    Optical module
    3.
    发明授权
    Optical module 有权

    公开(公告)号：US10390409B2

    公开(公告)日：2019-08-20

    申请号：US15857958

    申请日：2017-12-29

    申请人： Hisense Broadband Multimedia Technologies Co., Ltd. ,  Hisense Broadband Multimedia Technologies, Ltd.

    发明人： Long Zheng

    IPC分类号： G02B27/20 ,  H05B37/02 ,  F21V29/504 ,  F21V29/508 ,  F21V29/83 ,  F21V5/04 ,  F21V23/00 ,  G02B6/42 ,  H05K9/00 ,  H04B10/40 ,  H04B10/50 ,  H04B10/85 ,  H04B15/02

    摘要： This application discloses an optical module, including a circuit board, a lens assembly, a laser driver, and a limiting amplifier. Heat dissipation layers are disposed on the upper and lower surfaces of the circuit board. The laser driver and the limiting amplifier are mounted on the surface of the heat dissipation layer on the upper surface. Via holes are provided in projection regions of the laser driver and the limiting amplifier on the circuit board. Via holes penetrate the circuit board and are connected to the heat dissipation layers. Via holes are filled with a heat conductor, and the heat conductor is connected to the heat dissipation layers on the upper surface and the lower surface of the circuit board. The optical module disclosed in this application effectively dissipates heat generated by the laser driver and the limiting amplifier, thereby reducing the temperature in the optical module.

    Optical module
    6.
    发明授权
    Optical module 有权

    公开(公告)号：US10440799B2

    公开(公告)日：2019-10-08

    申请号：US15857987

    申请日：2017-12-29

    申请人： Hisense Broadband Multimedia Technologies Co., Ltd. ,  Hisense Broadband Multimedia Technologies, Ltd.

    发明人： Long Zheng

    IPC分类号： H04B10/00 ,  H05B37/02 ,  F21V29/504 ,  F21V29/508 ,  F21V29/83 ,  F21V5/04 ,  F21V23/00 ,  G02B6/42 ,  H04B10/40 ,  H04B10/50 ,  H04B10/85 ,  H04B15/02 ,  H05K9/00

    摘要： The present disclosure discloses an optical module, and relates to the field of optical fiber communication technologies. A first sealing piece is configured to block the gap between the optical fiber ribbon and the blocking piece. For the optical module and an optical communication terminal provided in the present application, an electromagnetic wave generated by the optical module is directly radiated or is reflected several times until the electromagnetic wave enters a wave-absorbing pad. The wave-absorbing pad absorbs to the greatest extent an electromagnetic wave generated by a chip, and can reduce to the greatest extent electromagnetic interference (EMI) generated by the optical module. By means of the present disclosure, the sealing performance of a housing of the optical module can be improved, so that an EMI shielding effect is improved, thereby effectively reducing EMI.

    Optical module
    7.
    发明授权
    Optical module 有权

    公开(公告)号：US10271403B2

    公开(公告)日：2019-04-23

    申请号：US15857884

    申请日：2017-12-29

    申请人： Hisense Broadband Multimedia Technologies, Co., Ltd. ,  Hisense Broadband Multimedia Technologies, Ltd.

    发明人： Long Zheng

    IPC分类号： G02B6/42 ,  H05B37/02 ,  F21V29/504 ,  F21V29/508 ,  F21V29/83 ,  F21V5/04 ,  F21V23/00 ,  H05K9/00 ,  H04B10/40 ,  H04B10/50 ,  H04B10/85 ,  H04B15/02

    摘要： This disclosure relates to optical module. In one implementation, the optical module includes a multi-layer circuit board, a first optical chip, a second optical chip, and a processor, wherein a surface layer on a same side of the circuit board comprises a first row of edge connector pins and a second row of edge connector pins; the first row of edge connector pins comprise a first power pin; the second row of edge connector pins comprise a second power pin; the first power pin is connected to the first optical chip; the second power pin connected to the second optical chip and the processor; the first power pin and the second power pin are aligned along a same direction and are arranged at a same position among the first row of edge connector pins and the second row of edge connector pins; and the first power pin is electrically connected to the second power pin. In another implementation, the first power pin and the second power pin is not electrically connected and wherein the circuit board further comprises a power delay circuit between the second power pin and the processor.

    Optical module
    8.
    发明授权
    Optical module 有权

    公开(公告)号：US09843158B2

    公开(公告)日：2017-12-12

    申请号：US15294544

    申请日：2016-10-14

    申请人： HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES, LTD. ,  HISENSE US CORPORATION ,  HISENSE INTERNATIONAL CO., LTD.

    发明人： Li Wang ,  Long Zheng ,  Hua Zhang

    IPC分类号： H01S5/026 ,  H01S5/042 ,  H01S3/091

    CPC分类号： H01S5/0261 ,  H01S3/0912 ,  H01S5/042 ,  H01S5/0427 ,  H01S5/06825 ,  H04B10/00

    摘要： The present application provides an optical module comprising: a golden finger, a MAC chip, a switch circuit, a laser driver, and a laser. A first output terminal of the MAC chip is connected to a first input terminal of the laser driver for inputting burst controlling signal thereto; a second output terminal of the MAC chip is connected to a first input terminal of the switch circuit for inputting cut-off controlling signal thereto; a cut-off controlling pin of the golden finger is connected to a second input terminal of the switch circuit for inputting cut-off controlling signal thereto; and an output terminal of the switch circuit is connected to a second input terminal of the laser driver. The switch circuit is used to connect the first or the second input terminal of the switch circuit with the output terminal. The cut-off controlling signal controls the switch-off of the laser.

    Optical module
    9.
    发明授权
    Optical module 有权

    公开(公告)号：US10257910B2

    公开(公告)日：2019-04-09

    申请号：US15857855

    申请日：2017-12-29

    申请人： Hisense Broadband Multimedia Technologies Co., Ltd. ,  Hisense Broadband Multimedia Technologies, Ltd.

    发明人： Long Zheng

    IPC分类号： H04K3/00 ,  H05B37/02 ,  F21V29/504 ,  F21V29/508 ,  F21V29/83 ,  F21V5/04 ,  F21V23/00 ,  G02B6/42 ,  H05K9/00 ,  H04B10/40 ,  H04B10/50 ,  H04B10/85 ,  H04B15/02

    摘要： The present disclosure generally relates to optical modules, and in particular, to an optical module comprising a printed circuit board for reducing crosstalk between differential signal lines. In one implementation, the printed circuit board comprises a top layer, a first intermediate signal transmission layer, a second intermediate signal transmission layer, a bottom layer and multiple ground layers between signal transmission layers. Each signal transmission layer comprises one or more differential signal line pairs. The top layer and the bottom layer each comprises an edge connector, and the top layer further comprises a laser driver chip. The signal transmission layers are connected to the edge connectors and laser driver chips via a combination of blind and through connection holes such that the interference between the differential signal line pairs of various signal transmission layers are reduced.