公开(公告)号：US20230191492A1

公开(公告)日：2023-06-22

申请号：US17996050

申请日：2020-04-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： William J Allen ,  Temiloluwa Adegoke ,  Matthew Gaubatz ,  John C Greeven ,  Daniel Mosher ,  Thomas A Saksa ,  Vanessa Verzwyvelt ,  Michael F Klopfenstein ,  Xin Cheng ,  Richard Sweet ,  Todd Hegert Goyen

IPC: B22F10/85 ,  B33Y50/02 ,  B22F10/38 ,  B22F10/32

CPC classification number: B22F10/85 ,  B33Y50/02 ,  B22F10/38 ,  B22F10/32 ,  B33Y10/00

Abstract: In some examples, a system receives measurement data obtained based on a non-destructive imaging of an identifiable structure within a three-dimensional (3D) object formed using an additive manufacturing machine, the identifiable structure formed based on control of a characteristic of a build material of a first internal object portion relative to a characteristic of the build material in a second internal object portion, the first and second internal object portions being within the 3D object. The system determines, based on the measurement data, a deviation of a physical property of the identifiable structure from a target physical property, and outputs information indicating the deviation.