-
公开(公告)号:US20210379830A1
公开(公告)日:2021-12-09
申请号:US17255149
申请日:2019-02-26
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: David Champion , Anthony Holden , Andrew L. Van Brocklin , Daniel Fradl
IPC: B29C64/291 , B29C64/393 , B29C64/277 , B29C64/165 , B29C64/295
Abstract: In an example implementation, a method of 3D printing includes receiving a 3D object model that defines the shape of an object to be printed in a layer-by-layer build process, and determining a desired thermal profile based on the shape of the object. For each object layer, a fusing energy radiation pattern is determined based on the desired thermal profile, and an electromagnetic energy emitter array is controlled to deliver fusing energy to the object layer according to the energy radiation pattern.
-
公开(公告)号:US12194533B2
公开(公告)日:2025-01-14
申请号:US17642258
申请日:2019-10-22
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Carl R. Reid , Daniel Fradl
Abstract: According to examples, an apparatus may include a processor and a memory on which are stored machine-readable instructions that when executed by the processor, cause the processor to access a 3D model of a 3D object to be fabricated and apply a deformation model to the 3D model. In some examples, the processor may generate a modified 3D model that compensates for a determined deformation of the 3D object during a sintering process for the 3D object. In some examples, the deformation model may include a densification component associated with a density of the 3D object and a deformation component associated with mechanical loads on the 3D object. The densification component may have initial state values associated with the density of the 3D object during the sintering process.
-
公开(公告)号:US20220326682A1
公开(公告)日:2022-10-13
申请号:US17642258
申请日:2019-10-22
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Carl R. Reid , Daniel Fradl
IPC: G05B19/4099 , G06F30/17 , B33Y50/00 , B22F10/80
Abstract: According to examples, an apparatus may include a processor and a memory on which are stored machine-readable instructions that when executed by the processor, cause the processor to access a 3D model of a 3D object to be fabricated and apply a deformation model to the 3D model. In some examples, the processor may generate a modified 3D model that compensates for a determined deformation of the 3D object during a sintering process for the 3D object. In some examples, the deformation model may include a densification component associated with a density of the 3D object and a deformation component associated with mechanical loads on the 3D object. The densification component may have initial state values associated with the density of the 3D object during the sintering process.
-
公开(公告)号:US11975547B2
公开(公告)日:2024-05-07
申请号:US17608078
申请日:2019-07-01
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Vignesh Kannan , Dennis R. Esterberg , Christie Dudenhoefer , Kenneth Ward , Matthew David Smith , Daniel Fradl
IPC: B41J29/13
CPC classification number: B41J29/13 , B01L2200/025 , B01L2200/0642 , B01L2300/0609 , H05K2201/10424 , H05K2201/10954
Abstract: In one example in accordance with the present disclosure, a fluid ejection controller is described. The fluid ejection controller includes a firing board to pass control signals to a fluid ejection device to eject fluid from the fluid ejection device. A mount pivotally holds the firing board between a disengaged position where electrical pins of the firing board are not in contact with electrical pads of the fluid ejection device and an engaged position where the electrical pins are in contact with the electrical pads. The mount includes a slot to receive the fluid ejection device and at least one biasing spring to bias the firing board away from the fluid ejection device during insertion of the fluid ejection device. The fluid ejection controller also includes a handle coupled to a cam shaft to move the firing board between the disengaged position and the engaged position.
-
-
-