公开(公告)号：US20120075822A1

公开(公告)日：2012-03-29

申请号：US12893634

申请日：2010-09-29

申请人： Hamid Habibi ,  Jin Zhang ,  Reza Imani ,  Asghar Dadashian

发明人： Hamid Habibi ,  Jin Zhang ,  Reza Imani ,  Asghar Dadashian

IPC分类号： H05K7/00 ,  B32B37/02

CPC分类号： B32B37/02 ,  B32B2309/105 ,  B32B2311/04 ,  B32B2311/12 ,  B32B2363/00 ,  B32B2457/08 ,  H05K7/06 ,  Y10T156/10

摘要： Disclosed herein are electronic devices, such as, for example, televisions, stereo systems, diagnostic equipment, cell phones, desktop or laptop PCs, medical pulse generators, or etc., including an integrated circuit including a printed circuit board including multiple layers and a wire bond pad. The multiple layers are sandwiched together in a planar unitary structure including a top surface, a bottom surface and a structure edge extending between the top surface and the bottom surface. The multiple layers include a first organic substrate layer joined to a second organic substrate layer. Each organic substrate layer includes a layer edge and a peripheral surface adjacent the layer edge. Each layer edge forms part of the structure edge. The wire bond pad includes an outer face, an inner face generally opposite the outer face, and a first rib. The inner face extends along the structure edge. The first rib projects generally perpendicular from the inner face between the first organic substrate layer and the second organic substrate layer and extends along the peripheral surface of at least one of the first organic substrate layer or the second organic substrate layer.

摘要翻译： 本文公开了电子设备，例如电视机，立体声系统，诊断设备，蜂窝电话，台式或膝上型PC，医疗脉冲发生器等，包括集成电路，其包括包括多层的印刷电路板和 导线焊盘。 多层被夹在一起的平面单一结构中，包括顶表面，底表面和在顶表面和底表面之间延伸的结构边缘。 多层包括与第二有机基底层接合的第一有机基底层。 每个有机衬底层包括层边缘和邻近层边缘的外围表面。 每个层边缘形成结构边缘的一部分。 引线接合焊盘包括外表面，大体与外表面相对的内表面和第一肋。 内表面沿着结构边缘延伸。 第一肋条从第一有机衬底层和第二有机衬底层之间的内表面大致垂直地延伸，并且沿着第一有机衬底层或第二有机衬底层中的至少一个的外周表面延伸。

公开(公告)号：US20130248496A1

公开(公告)日：2013-09-26

申请号：US13429033

申请日：2012-03-23

申请人： Reza Imani ,  Asghar Dadashian ,  Dro Darbidian ,  Hamid Habibi

发明人： Reza Imani ,  Asghar Dadashian ,  Dro Darbidian ,  Hamid Habibi

IPC分类号： B23K11/00

CPC分类号： B23K11/00 ,  B23K11/002 ,  B23K20/004 ,  H01L2224/45014 ,  H01L2224/78313

摘要： Disclosed herein is a resistance welding system for welding a ribbon to a bond site of a bond surface. The system includes a welding header, a bond header, a ribbon dispenser, a cutter, and a support surface. The welding header includes a resistance welding tip. The bond header includes a bond foot displaceable relative to the bond surface. The bond foot includes a welding aperture. The ribbon dispenser feeds the ribbon to the bond foot. The support surface is configured to support the bond surface. The bond foot is configured to press the ribbon against the bond site of the bond surface, which is thereby forced against the support surface. With the ribbon so pressed against the bond site, the system is configured to cause the welding tip to enter the welding aperture to resistance weld the ribbon to the bond site of the bond surface.

摘要翻译： 本文公开了一种用于将带焊接到接合表面的接合位置的电阻焊接系统。 该系统包括焊接头，接合头，色带分配器，切割器和支撑表面。 焊头包括电阻焊头。 结合头包括相对于粘合表面可移位的粘结脚。 焊脚包括焊接孔。 色带分配器将色带馈送到接合脚。 支撑表面被配置为支撑粘结表面。 接合脚构造成将带压靠在接合表面的结合位置，由此被迫抵靠支撑表面。 将带子按压在粘结部位上时，系统被配置成使焊接尖端进入焊接孔，以将焊带焊接到粘合表面的粘结部位。