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公开(公告)号：US20230089152A1
公开(公告)日：2023-03-23
申请号：US17758009
申请日：2020-02-21
Applicant: HUIZHOU TCL MOBILE COMMUNICATION CO., LTD
Inventor： Wei Chen , Song Bai , Weidong Luo
IPC: H05K9/00
Abstract: A conductive foam includes a foam body, a conductive cloth, and a conductive adhesive layer. The conductive cloth wraps an outer surface of the foam body and includes a device contact surface configured to contact an external device for assembly. The conductive adhesive layer is disposed on the device contact surface.
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