公开(公告)号：US20240298408A1

公开(公告)日：2024-09-05

申请号：US18660945

申请日：2024-05-10

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jun LIU ,  Zuomin LU ,  Tianyu LI

IPC: H05K1/18 ,  G01S7/481 ,  G03B30/00 ,  H04N23/54

CPC classification number: H05K1/18 ,  H04N23/54 ,  G01S7/4816 ,  G03B30/00 ,  H05K2201/10151 ,  H05K2201/10424

Abstract: The present disclosure relates to circuit board reinforcing structures, photosensitive apparatuses, and terminals. The photosensitive apparatus is used in assisted driving, intelligent driving, or autonomous driving. In one example circuit board reinforcing structure, a reinforcing plate of which deformation varies little with temperature is used to suppress warping and deformation of a circuit board caused by a temperature change, so that an impact of the warping and deformation of the circuit board on a location of a photosensitive chip is greatly reduced. In addition, the reinforcing plate and the photosensitive chip are disposed on a same side of the circuit board.