公开(公告)号：US20240164040A1

公开(公告)日：2024-05-16

申请号：US18416937

申请日：2024-01-19

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jun LUO ,  Zengguang GUO ,  Xiaokang XIAO

IPC: H05K5/06 ,  G02B6/42 ,  H05K1/02 ,  H05K3/28

CPC classification number: H05K5/069 ,  G02B6/4248 ,  H05K1/028 ,  H05K3/284

Abstract: This application provides an electrical lead-out structure and a preparation method thereof, a hermetic apparatus, and an optical communication device. The electrical lead-out structure is used for hermetic package. The electrical lead-out structure includes a flexible circuit board and a packaging layer. The flexible circuit board includes an electrical signal layer and a reinforcing layer that are stacked up, the reinforcing layer is provided with a window that passes through the reinforcing layer, the electrical signal layer is adjacent to the window, the packaging layer fills the window, and a side that is of the packaging layer and that faces the electrical signal layer is insulatingly adjacent to the electrical signal layer. The packaging layer is disposed on the flexible circuit board, so that in the electrical lead-out structure, a feed-through area used for soldering to a hermetic housing is formed.