公开(公告)号：US20200373218A1

公开(公告)日：2020-11-26

申请号：US16993071

申请日：2020-08-13

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Ye GUO ,  Lei SHI ,  Zhipeng ZHANG ,  Yonglan ZHANG ,  Yang CHEN ,  Yi FAN

IPC: H01L23/367 ,  H01L23/40 ,  H05K7/20

Abstract: A heat dissipation device includes a first radiator, a second radiator, and a first connecting device. The first radiator and second radiator are fastened onto a printed circuit board (PCB) by the first connecting device. The first radiator is over a first electronic device, and the second radiator is over a second electronic device. The first connecting device includes a first fixing pipe, a first fixing post and a first elastic element. The first radiator is fixed with the first fixing pipe, the first fixing post is sleeved in the first fixing pipe, an upper surface of the first fixing pipe abuts against a lower surface of a first convex portion of the first fixing post, a lower surface of the first fixing pipe abuts against an upper surface of the PCB, and the first fixing post extends through the second radiator and the first radiator from top to bottom.