公开(公告)号：US20220376194A1

公开(公告)日：2022-11-24

申请号：US17749255

申请日：2022-05-20

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yong PENG ,  Shuo WANG ,  Shengquan FU

IPC: H01L51/44 ,  H01L51/42 ,  H01L27/30

Abstract: The technology of this application relates to a cell assembly and a method for preparing a cell assembly. The cell assembly includes a first subcell, a second subcell adjacent to the first subcell, and a bottom electrode. Both the first subcell and the second subcell include a P-type layer and an N-type layer, and a light-harvesting layer located between the P-type layer and the N-type layer. The P-type layer of the first subcell is connected to the N-type layer of the second subcell by using the bottom electrode. A connection manner between subcells is provided. Compared with a current manner in which P1, P2, and P3 gaps are formed between subcells through cutting to implement interconnection, geometrical optical loss brought by interconnection between the subcells can be reduced.