公开(公告)号：US20240427082A1

公开(公告)日：2024-12-26

申请号：US18822928

申请日：2024-09-03

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Xinxiang NIU ,  Xiang ZHANG ,  Xiaowen DONG

IPC: G02B6/125 ,  G02B6/12 ,  G02B6/122 ,  G02B6/13

Abstract: This application provides an optical chip. The optical chip includes an optical substrate, and a first functional layer, a first space layer, and a second functional layer that are sequentially disposed on the optical substrate. A second optical structure is formed at the second functional layer. The second optical structure includes a second inter-layer coupling structure and a second intra-layer transmission structure, and the second intra-layer transmission structure is located in a first area of the second functional layer. A first optical structure located in a second area is formed at the first functional layer. The first optical structure includes a first inter-layer coupling structure and a first intra-layer transmission structure, and a projection of the second area in a normal direction of a plane of the optical substrate does not overlap with a projection of the first area in the normal direction of the plane of the optical substrate.