公开(公告)号：US20240302611A1

公开(公告)日：2024-09-12

申请号：US18669690

申请日：2024-05-21

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Wenqi Zhang ,  Meng Wang

IPC: G02B6/42

CPC classification number: G02B6/4248 ,  G02B6/4255 ,  G02B6/426 ,  G02B6/4274

Abstract: A photoelectric transceiver assembly includes: an electronic integrated circuit, including a first surface, a second surface opposite to the first surface, and a first sidewall located between the first surface and the second surface; a molding compound, performing molding on the electronic integrated circuit around the first sidewall, where the molding compound includes a third surface close to the first surface and a fourth surface close to the second surface, and the molding compound is provided with one or more through mold vias extending from the third surface to the fourth surface; a first redistribution layer, disposed on the first surface and the third surface and including a plurality of first bumps electrically coupled to the first surface and the one or more through mold vias; a second redistribution layer, disposed on the second surface and the fourth surface.