公开(公告)号：US12299517B2

公开(公告)日：2025-05-13

申请号：US18695334

申请日：2022-08-25

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yunpeng Shen ,  Jiahui Chu ,  Tengfei Huang ,  Bo Jiang ,  Xuming Chen ,  Jing Zhao

IPC: G06K19/077

Abstract: The present disclosure relates to communication tags and electronic devices. One example communication tag includes a circuit board and a chip disposed on the circuit board. Two coils are formed on the circuit board. The two coils are respectively disposed on two different conducting layers of the circuit board. Optionally, the two coils are disposed in an intersecting manner. In addition, lines for feeding the two coils are disposed close to each other.