公开(公告)号：US20230209717A1

公开(公告)日：2023-06-29

申请号：US18173320

申请日：2023-02-23

申请人： HUAWEI TECHNOLOGIES CO., LTD.

发明人： Yatao LV ,  Qingguo TANG ,  Ning WANG

IPC分类号： H05K1/18 ,  H05K3/28

CPC分类号： H05K1/181 ,  H05K3/28 ,  H05K2201/10242

摘要： Embodiments of this application disclose a packaging module and an electronic device. Both a first surface and a second surface of a PCB in the packaging module are covered with a molding layer, a conductive pin is electrically connected to the PCB, the conductive pin is packaged inside the molding layer along a stacking direction of the PCB and the molding layer, and the conductive pin is partially exposed on an outer surface of the molding layer. When the packaging module performs electrical interaction with another element, the PCB outputs or inputs an electrical signal by using the conductive pin. In this way, there is no need to reserve a through hole on a packaging side of the packaging module, the packaging module may be arranged at a position close to a chip, and there are short wires between the packaging module and the chip.