EARPHONE AND EARPHONE ASSEMBLY
    1.
    发明申请

    公开(公告)号:US20250126392A1

    公开(公告)日:2025-04-17

    申请号:US18987746

    申请日:2024-12-19

    Inventor: Li DONG

    Abstract: The present disclosure relates to earphones and earphone assemblies. One example earphone includes a housing, a first circuit board, and an antenna. Both the first circuit board and the antenna are located in the housing and are disposed in a stacked manner. The first circuit board and the antenna are structural members independent of each other. The first circuit board is located between the antenna and the housing. There is a touch sensor on a side that is of the first circuit board and that faces the housing, and the touch sensor is configured to detect a touch action performed on the housing. The antenna is configured to transmit/receive a radio frequency signal. The antenna of the earphone can provide a reference ground for the touch sensor.

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