公开(公告)号：US20230289646A1

公开(公告)日：2023-09-14

申请号：US18321851

申请日：2023-05-23

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yanxing LUO ,  Peng ZHAO ,  Xianfeng TANG ,  Kunzhe DAI

IPC: G06N10/40

CPC classification number: G06N10/40

Abstract: A quantum chip and a quantum computer are disclosed to resolve problems such as high difficulty in preparing the quantum chip and a low yield rate. The quantum chip provided in the present disclosure includes a substrate, M subchips, a coupling structure, and a cavity mode suppression structure. Each subchip includes N quantum bits, and the M subchips are spaced apart on a surface of the substrate. The coupling structure is configured to implement an interconnection between the M subchips. The cavity mode suppression structure is disposed on an edge of each subchip and/or in a gap between the M subchips, and is configured to increase a cavity mode frequency of the quantum chip. In the quantum chip provided in the present disclosure, the quantum chip includes the M subchips, so that preparation difficulty is effectively reduced and a preparation yield rate is improved.