公开(公告)号：US20230122445A1

公开(公告)日：2023-04-20

申请号：US18070699

申请日：2022-11-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Jianxin Fan ,  Guodong Zhang ,  Jian Zhang ,  Zhefeng Xiao

IPC: H01R12/73 ,  H01R12/70

Abstract: This application provides a board-level architecture and a communications device. The board-level architecture includes a support board, a switch board, and a press fit component. The press fit component includes a cable, a first connector component press-fitted on a side edge of the support board, and a second press fit cable connector press-fitted on a side edge of the switch board. The first connector component includes a first press fit cable connector and a pluggable connector that is electrically connected to the first press fit cable connector, and the pluggable connector is farther from the support board than the first press fit cable connector. The first press fit cable connector is connected to the second press fit cable connector through the cable.