公开(公告)号：US20210143141A1

公开(公告)日：2021-05-13

申请号：US17090510

申请日：2020-11-05

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yadong Bai ,  Zhijun Qu ,  Changxing Sun ,  Haitao Han

IPC: H01L25/18 ,  H01L23/31 ,  H01L23/00 ,  H05K1/18 ,  H05K1/11 ,  H05K1/14

Abstract: This application discloses a chip power supply system, a chip, a PCB, and a computer device. The chip power supply system includes a first printed circuit board (PCB), a chip, a power controller, and an inductor module. The first PCB includes N vias, first ends of the N vias are located at a top layer of the PCB, and second ends of the N vias are located at a bottom layer of the first PCB. The chip is coupled to the top layer of the first PCB through N power supply contacts and the first ends of the N vias. The inductor module is coupled to the chip through M power supply contacts and the second ends of M vias of the N vias. The power controller is coupled to the inductor module through the first PCB, and the power controller is configured to control the inductor module to supply power to the chip.

公开(公告)号：US11387226B2

公开(公告)日：2022-07-12

申请号：US17090510

申请日：2020-11-05

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Yadong Bai ,  Zhijun Qu ,  Changxing Sun ,  Haitao Han

IPC: H05K1/00 ,  H01L25/18 ,  H01L23/31 ,  H01L23/00 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  H01R12/71

Abstract: This application discloses a chip power supply system, a chip, a PCB, and a computer device. The chip power supply system includes a first printed circuit board (PCB), a chip, a power controller, and an inductor module. The first PCB includes N vias, first ends of the N vias are located at a top layer of the PCB, and second ends of the N vias are located at a bottom layer of the first PCB. The chip is coupled to the top layer of the first PCB through N power supply contacts and the first ends of the N vias. The inductor module is coupled to the chip through M power supply contacts and the second ends of M vias of the N vias. The power controller is coupled to the inductor module through the first PCB, and the power controller is configured to control the inductor module to supply power to the chip.