公开(公告)号：US11805592B2

公开(公告)日：2023-10-31

申请号：US17155324

申请日：2021-01-22

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chaojun Deng ,  Fei Ma ,  Wei Fang ,  Zhiwen Yang ,  Chungang Li ,  Shun Hao

IPC: H05K7/20 ,  G02B6/42 ,  H05K1/02 ,  H05K1/18 ,  H05K7/02

CPC classification number: H05K1/0203 ,  G02B6/4269 ,  G02B6/4284 ,  H05K1/181 ,  H05K7/023 ,  H05K7/026 ,  H05K7/20409

Abstract: A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.

公开(公告)号：US20240071859A1

公开(公告)日：2024-02-29

申请号：US18492967

申请日：2023-10-24

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Zelong Jiao ,  Chungang Li ,  Chengpeng Yang

IPC: H01L23/367 ,  H01L23/00

CPC classification number: H01L23/3675 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29191 ,  H01L2224/29193 ,  H01L2924/0715

Abstract: A chip package structure is provided and includes a PCB, a chip, a package cover, a thermal interface material layer, and a heat sink. The chip is welded to the PCB. The package cover is disposed on the PCB. The chip is packaged in the package cover. The thermal interface material layer covers the chip, and is attached to an inner top surface of the package cover. The heat sink is disposed on the PCB. An assembly space is formed between the heat sink and the PCB. The heat sink includes a contact plate. A lower end face of the contact plate abuts against an outer top surface of the package cover. A projection of the abutting member in a height direction of the chip package structure covers the chip, and is located in a region enclosed by an edge of the outer top surface of the package cover.

公开(公告)号：US12058803B2

公开(公告)日：2024-08-06

申请号：US18372828

申请日：2023-09-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chaojun Deng ,  Fei Ma ,  Wei Fang ,  Zhiwen Yang ,  Chungang Li ,  Shun Hao

IPC: H05K7/20 ,  G02B6/42 ,  H05K1/02 ,  H05K1/18 ,  H05K7/02

CPC classification number: H05K1/0203 ,  G02B6/4269 ,  G02B6/4284 ,  H05K1/181 ,  H05K7/023 ,  H05K7/026 ,  H05K7/20409

Abstract: A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.

公开(公告)号：US11619786B2

公开(公告)日：2023-04-04

申请号：US17037355

申请日：2020-09-29

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Hualiang Shi ,  Banghong Hu ,  Wei Fang ,  Chungang Li ,  Yiguo Qi ,  Juanjuan Cao

IPC: G02B6/38

Abstract: Embodiments of this application provide an optical fiber ferrule, where n rows of optical fiber holes are symmetrically distributed on a mating end face of the ferrule, n>=3, and n is an odd number. Based on the layout design of optical fiber holes on the optical fiber ferrule, this application provides an optical fiber connector that includes a plurality of rows of optical fiber holes and that is compatible with one row and a relatively small number of rows of optical fiber holes, so that an optical fiber connector with a large number of cores can be forward compatible with an optical fiber connector with a small number of cores, thereby improving expandability and compatibility of the optical fiber ferrule.