公开(公告)号：US20230344126A1

公开(公告)日：2023-10-26

申请号：US18215342

申请日：2023-06-28

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Weimin LI ,  Xinming LIU ,  Chongyang WANG ,  Hongzhi ZHANG

IPC: H01Q3/38 ,  H01Q1/24

CPC classification number: H01Q3/38 ,  H01Q1/246

Abstract: This application provides an electronic component, capable of simplifying a structure of an electronic component. The electronic component includes a printed circuit board (PCB) and a cavity. An inner wall of the cavity is provided with at least one groove for fixing the PCB. A first groove in the at least one groove includes a first side wall and a second side wall. The first side wall and the second side wall form an opening of the first groove. A length of the first side wall in a first direction is greater than that of the second side wall. The first direction is parallel to a direction of the opening. The first side wall is provided with at least one first raised part. The first raised part protrudes from the first side wall to the second side wall along a second direction. The second direction is perpendicular to the first direction.