公开(公告)号：US20250097165A1

公开(公告)日：2025-03-20

申请号：US18961342

申请日：2024-11-26

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Junen Gao ,  Xiaochu Li ,  Zhongjun Xia ,  Baojun Yuan

IPC: H04L49/109 ,  H04L41/12

Abstract: A computing system includes a plurality of fusion nodes and a plurality of switching nodes. A first fusion node in the plurality of fusion nodes includes a plurality of computing chips and at least one first switching chip. The at least one first switching chip is configured to implement communication connection between the plurality of computing chips. A first switching node in the plurality of switching nodes is coupled to the first fusion node through a connector. The first switching node is configured to implement communication connection between the first fusion node and another fusion node in the plurality of fusion nodes. The switching chip and the computing chips are deployed nearby. A mode of orthogonal connection and two-level data exchange is used between the plurality of fusion nodes and the plurality of switching nodes, to build a high-density system with high performance, a high bandwidth, and low latency.