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公开(公告)号：US10785873B1
公开(公告)日：2020-09-22
申请号：US16405348
申请日：2019-05-07
发明人： Hou-Yuan Chou , Yi-Chih Wu
摘要： A circuit board optimized for a denser component population within a standard size of footprint includes a mother board and a plurality of sub-board layers stacked on and connected to the mother board. Each of the sub-board layers has a plurality of daughter boards. The sub-board layers are composed of a first sub-board layer and a second sub-board layer. The daughter boards of the first sub-board layer are arranged on a side of the mother board, and the daughter boards of the second sub-board layer are arranged on the daughter boards of the first sub-board layer.
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公开(公告)号：US10390430B1
公开(公告)日：2019-08-20
申请号：US16175866
申请日：2018-10-31
发明人： Hou-Yuan Chou , Yi-Chih Wu
IPC分类号： H05K1/11
摘要： A circuit board includes a board defining a holding slot and a connector. The connector includes a conductive column and a pad fixed to one end of the conductive column. The pad is received within the holding slot. The conductive column is fixed within the board. The pad is soldered to a connecting portion of an electrical component. The pad defines a first through hole receiving solder when the connecting portion of the electrical component is soldered to the pad.
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公开(公告)号：US11596067B2
公开(公告)日：2023-02-28
申请号：US16768698
申请日：2020-04-23
发明人： Hou-Yuan Chou , Yi-Chih Wu
摘要： An apparatus having stacked circuit boards has been disclosed. The apparatus includes a main circuit board and a sub circuit board disposed over the main circuit board. A plurality of sub components disposed on a bottom face of the sub circuit board penetrates through main circuit board and extends towards a bottom face of the main circuit board. In this say, a compact apparatus is produced.
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公开(公告)号：US11871510B2
公开(公告)日：2024-01-09
申请号：US17050848
申请日：2020-09-14
发明人： Hou-Yuan Chou , Yi-Chih Wu , Feng-Hua Deng , Ming-Fang Chen
CPC分类号： H05K1/0251 , H05K3/10 , H05K2201/09236
摘要： A conductive pattern has been disclosed. The conductive pattern includes a pair of conductive traces. Each of the conductive traces comprises a linear portion and a terminal portion. The terminal portions are arranged adjacent to each other and comprises a pair of circular arc profile with a pair of complementary notches facing toward each other.
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公开(公告)号：US10470308B1
公开(公告)日：2019-11-05
申请号：US16186295
申请日：2018-11-09
发明人： Hou-Yuan Chou , Ming-Fang Chen , Yi-Chih Wu
摘要： A circuit board assembly comprising a printed circuit main board and a printed circuit sub-board, to avoid layout constraints, can support components on either board. The printed circuit main board includes first signal layer, and first and second through holes in the first signal layer. A first wire electrically couples a first electronic component and the first through hole. A second signal layer with third and fourth through holes is found on the printed circuit sub-board. The third through hole is electrically coupled to the first through hole, and the fourth through hole is electrically coupled to the second through hole.
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