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公开(公告)号：US20150262725A1
公开(公告)日：2015-09-17
申请号：US14626336
申请日：2015-02-19
Applicant: Hitachi Metals, Ltd.
Inventor： Hideyuki SAGAWA , Keisuke FUJITO
CPC classification number: C22C9/00 , B32B1/08 , B32B15/01 , B32B15/043 , B32B15/20 , B32B2255/06 , B32B2255/205 , B32B2307/202 , B32B2457/00 , C22C14/00 , Y10T428/12438 , Y10T428/12806 , Y10T428/12812
Abstract: A composite conductor is composed of a core including a titanium or a titanium alloy, a cladding layer including a copper and being provided to clad an outer periphery of the core, and an intermetallic compound layer being formed by diffusions of the titanium or titanium alloy included in the core and the copper included in the cladding layer, and being provided between the core and the cladding layer.
Abstract translation: 复合导体由包括钛或钛合金的芯体，包含铜的包覆层构成并且被设置成包覆芯的外周，并且包括由包含钛或钛合金的扩散形成的金属间化合物层 在包层中包含的芯和铜中，并且设置在芯和包覆层之间。
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公开(公告)号：US20170261265A1
公开(公告)日：2017-09-14
申请号：US15447261
申请日：2017-03-02
Applicant: HITACHI METALS, LTD.
Inventor： Keisuke FUJITO , Shohei Hata , Takayuki Tsuji , Hiromitsu Kuroda
Abstract: There is provide an apparatus for manufacturing a copper alloy metal material, including: a tundish in which molten copper is stored; a pouring nozzle through which the molten copper passes, the molten copper being flowed out from the tundish; a pressure variation device that varies a pressure applied to the pouring nozzle by the molten copper; and a controller that controls the pressure variation device so as to remove inclusions adhered to the pouring nozzle, by increasing the pressure applied to the pouring nozzle by the molten copper.
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公开(公告)号：US20150152567A1
公开(公告)日：2015-06-04
申请号：US14497709
申请日：2014-09-26
Applicant: Hitachi Metals, Ltd.
Inventor： Hideyuki SAGAWA , Keisuke FUJITO , Takumi SATO , Hiromitsu KURODA
CPC classification number: C25D7/0614 , C25D5/50 , Y10T428/1266
Abstract: A copper foil includes a copper-based metal sheet including mainly a copper, and a surface-treated layer that is provided on the copper-based metal sheet and includes an amorphous layer including oxygen and a metal with a higher oxygen affinity than a copper. A total thickness of the copper-based metal sheet and the surface-treated layer is less than 0.55 mm.
Abstract translation: 铜箔包括主要包括铜的铜基金属片和设置在铜基金属片上的表面处理层，并且包括非晶层，其包含氧和具有比铜更高的氧亲和力的金属。 铜基金属片和表面处理层的总厚度小于0.55mm。
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公开(公告)号：US20140205491A1
公开(公告)日：2014-07-24
申请号：US14140615
申请日：2013-12-26
Applicant: HITACHI METALS, LTD.
Inventor： Keisuke FUJITO , Seigi AOYAMA , Toru SUMI , Hideyuki SAGAWA , Yuju ENDO
Abstract: A copper alloy material includes an additional element M including Ti, and a balance having copper and an inevitable impurity. An atomic ratio of the additional element M to oxygen is in a range of 0.33≦M/O≦1.5.
Abstract translation: 铜合金材料包括包含Ti的附加元素M，以及具有铜和不可避免的杂质的余量。 附加元素M与氧的原子比在0.33≤n1E的范围内; M / O和nlE; 1.5。
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公开(公告)号：US20200373049A1
公开(公告)日：2020-11-26
申请号：US16874231
申请日：2020-05-14
Applicant: Hitachi Metals, Ltd.
Inventor： Keisuke FUJITO , Shohei HATA , Hiromitsu KURODA , Takayuki TUJI
Abstract: An insulated electric wire is composed of a conductor composed of a copper material, and an electrical insulating layer provided on an outer periphery of the conductor. For the constituent conductor of the insulated electric wire, in an orientation intensity ratio obtained by X-ray diffraction of a transverse cross section of the conductor, an intensity in a [200] crystal orientation is higher than an intensity in a [111] crystal orientation.
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Patent Agency Ranking
公开(公告)号：US20170016090A1
公开(公告)日：2017-01-19
申请号：US15052657
申请日：2016-02-24
Applicant: Hitachi Metals, Ltd.
Inventor： Shohei HATA , Takayuki TSUJI , Hiromitsu KURODA , Keisuke FUJITO
Abstract: A copper alloy material production method is provided. A copper raw material including not higher than 30 ppm by mass of oxygen is melted to form a molten copper. Not lower than 4 ppm by mass and not higher than 55 ppm by mass of titanium is added to the molten copper. After the adding of the titanium, not lower than 100 ppm by mass and not higher than 7000 ppm by mass of magnesium is added.
Abstract translation: 提供了铜合金材料的制造方法。 包含不高于30质量ppm的氧的铜原料被熔化以形成熔融铜。 向熔融铜中加入不低于4质量ppm且不高于55质量ppm的钛。 添加钛后，添加不低于100质量ppm且不高于7000质量ppm的镁。
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公开(公告)号：US20150243401A1
公开(公告)日：2015-08-27
申请号：US14597699
申请日：2015-01-15
Applicant: Hitachi Metals, Ltd.
Inventor： Keisuke FUJITO , Hideyuki SAGAWA , Toru SUMI
IPC: H01B1/02
CPC classification number: H01B1/026 , Y10T428/294 , Y10T428/2942
Abstract: A conductor includes a copper alloy including crystal grains. The crystal grains include a first crystal grain group having a grain size larger than a predetermined standard grain size and a second crystal grain group having a grain size smaller than the predetermined standard grain size. The crystal grains have a local maximum value of grain size distribution in each of the first crystal grain group and the second crystal grain group.
Abstract translation: 导体包括含有晶粒的铜合金。 晶粒包括晶粒尺寸大于预定标准晶粒尺寸的第一晶粒组和晶粒尺寸小于预定标准晶粒尺寸的第二晶粒组。 晶粒在第一晶粒组和第二晶粒组各自具有粒度分布的局部最大值。
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公开(公告)号：US20220084723A1
公开(公告)日：2022-03-17
申请号：US17410770
申请日：2021-08-24
Applicant: Hitachi Metals, Ltd.
Inventor： Hiromitsu KURODA , Tamotsu SAKURAI , Keisuke FUJITO , Yoshiki NAKADE , Detian HUANG , Hideki NONEN
IPC: H01B11/18 , H01B13/016 , H01B13/22 , G01N23/2252
Abstract: A coaxial cable is composed of a conductor, an insulator around the conductor, a shield layer around the insulator, and a sheath around the shield layer. The shield layer includes a lateral winding shielding portion with metal wires helically wrapped around the insulator, and a batch plating portion covering the lateral winding shielding portion. The shield layer includes a joining portion where adjacent metal wires are joined with each other with the batch plating portion at a gap between the adjacent metal wires, and inner peripheral portions where the metal wires are not being covered with the batch plating portion and plating layers are exposed. The joining portion is provided between adjacent inner peripheral portions. When an elemental analysis is performed in any analysis region having an area of 0.015 mm2 or more and 0.300 mm2 or less in an insulator-side surface of the shield layer which is stripped from the insulator, an area of a chlorine present region where chlorine is present in the analysis region is 5% or less of an area of the analysis region.
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公开(公告)号：US20190272932A1
公开(公告)日：2019-09-05
申请号：US16144191
申请日：2018-09-27
Applicant: Hitachi Metals, Ltd.
Inventor： Hiromitsu KURODA , Shohei HATA , Takayuki TSUJI , Keisuke FUJITO
Abstract: An insulated wire includes a conductor including a copper material, and an insulation layer that is formed on an outer periphery of the conductor. A restoring temperature TB of the conductor is not more than 130° C. The restoring temperature TB is a temperature that is needed to restore a conductivity of the conductor after a coil processing to a conductivity of the conductor before the coil processing.
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10.发明申请公开(公告)号：US20140209349A1
公开(公告)日：2014-07-31
申请号：US14091674
申请日：2013-11-27
Applicant: HITACHI METALS, LTD.
Inventor： Hideyuki SAGAWA , Seigi AOYAMA , Toru SUMI , Keisuke FUJITO , Detian HUANG
IPC: H01B11/18 , H01B13/016
CPC classification number: H01B1/026
Abstract: A high-speed transmission cable conductor includes a core material includes mainly copper, and a surface treated layer formed around a surface of the core material. The surface treated layer includes an amorphous layer including a metal element having a higher affinity for oxygen than the copper, and oxygen.
Abstract translation: 高速传输电缆导体包括主要包括铜的芯材和在芯材表面周围形成的表面处理层。 表面处理层包括非晶层，其包括对铜的氧的亲和性高于铜的金属元素和氧。
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