公开(公告)号：US20030127593A1

公开(公告)日：2003-07-10

申请号：US10196274

申请日：2002-07-17

Applicant: Hitachi High-Technologies Corporation

Inventor： Hiroyuki Shinada ,  Hisaya Murakoshi ,  Hideo Todokoro ,  Hiroshi Makino ,  Yoshihiro Anan

IPC: H01J037/29

CPC classification number: H01J37/29 ,  H01J2237/2817

Abstract: An electric field for decelerating an electron beam is formed on a surface of a sample semiconductor to be inspected, an electron beam having a specific area (a sheet electron beam) and containing a component having such an energy as not to reach the surface of the sample semiconductor is reflected in the very vicinity of the surface of the sample semiconductor by action of the electric field for deceleration and then forms an image through an imaging lens. Thus images of plural fields on the surface of the sample semiconductor are obtained and are stored in image memory units. By comparing the stored images of the plural fields with one another, the presence and position of a defect in the fields are determined.

Abstract translation: 在要检查的样品半导体的表面上形成用于减小电子束的电场，具有特定面积的电子束（片状电子束）并且包含具有不能到达表面的能量的成分 通过用于减速的电场的作用，样品半导体在样品半导体的表面的非常附近被反射，然后通过成像透镜形成图像。 因此，获得样品半导体表面上的多个场的图像并将其存储在图像存储单元中。 通过将存储的多个场的图像相互比较，确定场中的缺陷的存在和位置。

公开(公告)号：US20040227079A1

公开(公告)日：2004-11-18

申请号：US10843642

申请日：2004-05-12

Applicant: HITACHI HIGH-TECHNOLOGIES CORPORATION

Inventor： Yasuhiko Nara ,  Masaaki Nojiri ,  Kouichi Hayakawa ,  Hiroyuki Shinada ,  Yukio Hagita

IPC: H01J037/28

CPC classification number: H01J37/28 ,  H01J2237/004 ,  H01J2237/2817

Abstract: In a circuit pattern inspection apparatus, while an electron beam is irradiated onto a surface of a substrate having a plurality of chips where circuit patterns have been formed, a signal produced from the irradiated substrate is detected so as to form an image, and then, the formed image is compared with another image in order to detect a defect on the circuit patterns. Before the electron beam is irradiated onto either the chip or the plurality of chips so as to acquire the image for an inspection purpose, an electron beam is previously irradiated onto the region to be irradiated, so that charging conditions of the substrate to be inspected are arbitrarily controlled.

Abstract translation: 在电路图案检查装置中，当电子束照射到已经形成电路图案的具有多个芯片的基板的表面上时，检测从照射的基板产生的信号以形成图像， 将形成的图像与另一图像进行比较，以便检测电路图案上的缺陷。 在将电子束照射到芯片或多个芯片上以获取用于检查目的的图像之前，将电子束预先照射到要照射的区域上，使得要检查的基板的充电条件为 任意控制