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公开(公告)号：US10520816B2
公开(公告)日：2019-12-31
申请号：US15313232
申请日：2014-12-17
发明人： Masakazu Kume , Momoko Munakata
IPC分类号： G03F7/20 , G03F7/30 , G03F7/031 , G03F7/032 , G03F7/033 , G03F7/26 , G03F7/028 , H05K3/18 , G03F7/11 , G03F7/16 , G03F7/32 , H05K3/06 , G03F7/027
摘要： An object is to provide a method for forming a resist pattern able to form a resist pattern, in which the resist shape is favorable, the occurrence of resist footing can be reduced, and the adherence and the aspect ratio are improved; and provided is a method for forming a resist pattern comprising a step of forming a photosensitive resin layer on a substrate using a photosensitive resin composition for projection exposure; a step of exposing the photosensitive resin layer to active light projecting an image of a photomask through a lens; and a step of removing an unexposed part of the photosensitive resin layer from the substrate by development, wherein the photosensitive resin composition for projection exposure comprises an (A) binder polymer, a (B) photopolymerizing compound having an ethylenically unsaturated bond, and a (C) photopolymerization initiator; and a light transmittance of the photosensitive resin layer at a wavelength of 365 nm is not less than 58.0% and not more than 95.0%.
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公开(公告)号：US09989854B2
公开(公告)日：2018-06-05
申请号：US14906595
申请日：2014-07-22
发明人： Masakazu Kume , Momoko Munakata
IPC分类号： G03F7/04 , G03F7/40 , G03F7/11 , H01L21/027 , G03F7/38 , H01L21/033 , G03F7/027 , H05K3/10 , G03F7/033 , C23C18/16 , G03F7/031 , G03F7/20 , G03F7/32
CPC分类号： G03F7/11 , C23C18/1605 , C23C18/1633 , G03F7/027 , G03F7/031 , G03F7/033 , G03F7/20 , G03F7/32 , G03F7/38 , G03F7/40 , H01L21/0274 , H01L21/0332 , H01L21/0337 , H05K3/108
摘要： An object of the present invention is to provide a photosensitive resin composition for projection exposure capable of forming a resist pattern that is excellent in adhesion, resolution, and inhibitory properties against the occurrence of resist footing, and the present invention provides a photosensitive resin composition for projection exposure comprising (A) a binder polymer; (B) a photopolymerizable compound having an ethylenically unsaturated bond; (C) a photopolymerization initiator; and (D) a sensitizing dye, wherein the (B) photopolymerizable compound having an ethylenically unsaturated bond comprises a (meth)acrylate compound having a skeleton derived from dipentaerythritol and a compound represented by the following formula (III): wherein R8, R9, R10, and R11 each independently represent a hydrogen atom or a methyl group, X and Y each independently represent an ethylene group or a propylene group, p1, p2, q1, and q2 each independently represent a numerical value of 0 to 9, both p1+q1 and p2+q2 are 1 or more, and p1+q1+p2+q2 is 2 to 9.
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