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公开(公告)号：US20210276338A1
公开(公告)日：2021-09-09
申请号：US16493071
申请日：2017-11-10
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, LP.
Inventor： Si-Lam Choy
IPC: B41J2/175
Abstract: An assembly, in an example, may include at least one die, a substrate comprising at least one electrical trace, a lid coupled to a first side of the substrate to contain an amount of fluid between the substrate and lid, and an adhesive film coupled to a second side of the substrate to protect the at least one electrical trace wherein the lid further comprises a main chamber for each of at least two distinct fluids and an overflow chamber fluidically coupled to each of the main chambers via an overflow channel.
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